passive substrate

英 [ˈpæsɪv ˈsʌbstreɪt] 美 [ˈpæsɪv ˈsʌbstreɪt]

网络  无源衬底

计算机



双语例句

  1. Microwave transmission line made on high-resistivity silicon substrates is the basic structure of microwave passive, active components and integrate circuits which are fabricated on the same substrate.
    高阻硅基微带传输线是在高阻硅基上实现微波无源、有源及微波集成电路的重要构成基础。
  2. This paper is describes the technology trend of passive component embedded ceramic substrate, integrated passive device ( IPD) Si substrate, passive Component embedded or passive and active component embedded resin substrate.
    概述了埋入无源元件陶瓷基板,集成无源元件(IPD)硅基板,埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。
  3. This thesis is mainly about the analysis and design of passive filters in Low-Temperature Co-fired Ceramic ( LTCC) substrate.
    本文主要工作是关于低温共烧陶瓷中无源滤波器的分析与设计。
  4. A monolithic microwave integrated circuit ( MMIC) is a microwave circuit in which the active and passive components are fabricated on the same semiconductor substrate.
    单片微波集成电路(MMIC)是将有源元件和无源元件都集成在同一个半导体衬底上的微波电路;
  5. As a result, the MEMS RF/ MW passive devices with the lateral dimension of hundreds microns and good high frequency performance, such as switch, transmission line, inductor and capacitor, could be integrated on the silicon substrate by this technology.
    因此,预计用这种技术,可以在Si片上集成横向尺寸为数百微米,具有优良高频性能的MEMSRF/MW无源器件,如开关、传输线、电感和电容等。
  6. LTCC technology can realize the integrated circuit design of millimeter wave components, the passive components will be mounted inside the substrate, and the active chips can be integrated installation of the circuit board surface or mounted in the internal cavity.
    可以实现毫米波收发组件电路集成化设计,组件中的无源器件被填埋设计在基板内部,有源芯片集成安装在电路板的表面,或者安装在内部空腔中。